To support the next generation of Intel and AMD server platforms, Samsung plans to launch a new series of DDR5 server RAMs, including the first 512 GB RDIMM/LRDIMM memory and works based on 16 and 24 GB DDR5 devices. 

Samsung will take its next innovative step in the DDR5 world in early 2023 with the release of a 32GB RAM IC, allowing the company to achieve 1TB module manufacturing technology in late 2023 or early 2024. Meanwhile, Samsung is looking to release ICs with a data transfer rate of 7200 megabits per second.

The supply of 1 TB DDR5 RDIMM RAMs until 2024 and 2 TB shortly.

The DDR5 technology features of the JEDEC standard offer many advantages to server platforms. In addition to improving performance scalability, chip and module capacity is also improved along with reliability, leading to new ways to improve performance.

In addition, the features of the mentioned technology provide the possibility of producing integrated memories up to 64 GB and placing 16 DDR5 ICs with a capacity of less than 64 GB in one chip. Therefore, the emergence of 32GB DDR5 ICs is not surprising.

Aaron Choi, one of the engineers of Samsung’s memory planning department, said in the joint video conference of the company and AMD:

Currently, 32GB DDR5 memories are being developed under the new 14nm process node and are scheduled to be introduced early next year. UDIMM stacks based on 32GB memory will be available late next year or early 2021.

Samsung will unveil the first 32GB DDR5 RAM for PCs by the end of 2023

Samsung plans to officially introduce its 32GB DDR5 devices early next year to celebrate its success in completing the development of said technology. These chips will evolve by the end of 2023, and Samsung may officially unveil the first products based on them, including 32GB unbuffered RAM for PCs. Then, the world’s memory giant will unveil its 1TB DDR5 RAM module, which uses 32 32GB 8-Hi stacks and will be available for server platforms in the 2024-2025 timeframe.

DRAM makers like Samsung currently use 8-Hi stacks with up to eight memory devices but will move to more giant piles in the coming years. For example, cramming 16 32GB RAM ICs or 8 64GB RAM ICs into a single stack allows Samsung to build 2TB DDR5 server modules, enabling machines with tens of terabytes of memory per socket. For example, a 12-channel RAM subsystem that supports two DIMMs per channel can have up to 48 TB of RAM.

The arrival of DDR5-7200 RAM in the market in 2025

Once Samsung can push the capabilities of its 32GB DDR5 memory devices to 16GB ICs, these chips will allow for very affordable 32GB single-sided DIMMs that would enable desktop enthusiasts to upgrade their systems without breaking the bank. Equipped with 128 GB of temporary memory.

Samsung will soon officially introduce ICs that benefit from data transfer speeds of 5200 to 5600 Mbps.

But although memory capacity is significant, its speed is also critical for users. For this reason, Samsung is working hard to improve the performance of DDR5 memory. Samsung will soon officially introduce ICs that benefit from data transfer speeds of 5200 to 5600 Mbps and are designed for future personal computers. Manufacturers such as Corsair and JSkill are expected to use such chips to do modules with a speed of 6800 to 7000 Mbs; However, more voltage is needed.

Samsung has talked about DDR5-7200 RAM for a long time but never commented on its production time. Finally, in the joint conference with AMD, the production of DDR5-7200 RAMs was attributed to 2025 in the slide. Samsung plans to introduce 1.1V DDR5 chips with a speed of 7,200 megabytes in the UK with the JEDEC standard in 2025. Therefore, new RAM modules with such ICs can be expected to achieve speeds of 10,000 Mbs or more.

Samsung server DDR5 memory series; Ready for the next generation of server platforms

Samsung and its industry peers have been talking about server-specific DDR5 memory modules for some time. Still, until now, due to the lack of a server platform that supports the new type of memory, these talks have remained limited to expressing the benefits of DDR5 or boasting to DRAM manufacturers. They have not been put to practical use. Fortunately, the new modules are finally available now that the next generation of Intel and AMD server platforms are coming.

Samsung officially announced its 512GB DIMM DDR5 memory module in mid-2021 and even started sampling it. Samsung’s module uses 32 16GB stacks based on eight 16GB DRAM devices and is the pinnacle of today’s DRAM industry.

The above modules will be available in late 2022 or early 2023 for AMD’s next-generation EPYC ‘Genoa’ and Intel’s Xeon Scalable ‘Sapphire Rapids’ server platforms.

But not everyone needs a 512 GB memory module; For this reason, Samsung introduced 24GB DDR5 ICs in late July, which can support 24GB, 48GB, and 96GB or more. For now, Samsung hasn’t said anything about 348GB and 768GB RAM-based 24GB devices. However, this year’s line of DDR5 modules from the company range from 16GB to 512GB, which is enough to meet the next-generation EPYC ‘Genoa’ and Xeon Scalable ‘Sapphire Rapids’ server platforms shortly.

Last year, Samsung introduced 14nm DDR5 DRAMs, which are now on the rise, according to Arvi Choi. 14nm technology can revolutionize the memory world by making larger 24GB dies that come with AMD’s powerful servers. This year, Samsung created several modules based on the 24 GB RAM die.

While the 24GB, 48GB, or 96GB modules aren’t as mind-blowing as the 512GB RAM, they could come in handy for AMD’s next-generation ‘Genoa’ and Bergamo’ EPYC-based servers. Since AMD’s next-generation server platforms support 12-channel memory, these modules can use to build machines with 288, 576, or 1152 GB of DDR5 memory per socket, which is pretty impressive. Also, unlike Samsung’s 512GB RDIMMs that use the 8- Hi 3DS stacks, the 24GB, 48GB, and 96GB modules can provide a unique combination of capacity, performance, and price because they don’t require complex stacking.

Conclusion

Samsung is ready to release a series of DDR5 server memories based on 16 and 24-GB ICs. These RAMs have a capacity of 16 to 512 GB and support the speed provided by AMD’s Genoa/Bergamo and Intel’s Sapphire Rapids platforms.

Samsung’s next step is to introduce a 32GB DDR5 integrated die and bring it to market by late 2023 or early 2024. The chips will allow Samsung to make 1TB DDR5 memory modules for future server platforms and low-cost 32GB UDIMMs for PCs.

Samsung intends to take reasonable steps in the speed sector by releasing DDR5-7200+ ICs with a voltage of 1.1 in 2025 and provide professional users with the possibility of memory overclocking up to a speed of 10,000 Mbs or more.